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Overview
This Advanced Semiconductor Packaging course is offered by Coursera in partnership with Arizona State University. This course is part of Semiconductor Packaging Specialization
What you'll learn
Introduction to Pathway for Assembly and Packaging technologies
The evolution and impact of packaging on product performance and innovation.
Build your subject-matter expertise
- Learn new concepts from industry experts
- Gain a foundational understanding of a subject or tool
- Develop job-relevant skills with hands-on projects
- Earn a shareable career certificate
Programme Structure
Courses included:
- Packaging Trends
- Heterogeneous Integration
- Advanced Packaging End of Course Summary
Key information
Duration
- Part-time
- 1 days
Start dates & application deadlines
You can apply for and start this programme anytime.
Language
English
Delivered
Online
Campus Location
- Mountain View, United States
Disciplines
General Engineering & Technology View 31 other Short Courses in General Engineering & Technology in United StatesWhat students do after studying
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Academic requirements
We are not aware of any specific GRE, GMAT or GPA grading score requirements for this programme.
English requirements
We are not aware of any English requirements for this programme.
Other requirements
General requirements
- Beginner level
- No prior experience required
Tuition Fees
Additional Details
Course is free for the first 7 days. After 7 days, the course can be accessed with the Coursera Plus Subscription
Funding
Coursera provides financial aid to learners who cannot afford the fee. Apply for it by clicking on the Financial Aid link beneath the "Enroll" button on the left. You'll be prompted to complete an application and will be notified if you are approved. You'll need to complete this step for each course in the Specialization, including the Capstone Project.
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